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SCIENCE & EDUCATION

Bauman Moscow State Technical University.   El № FS 77 - 48211.   ISSN 1994-0408

Thermally isolated cells in designs of transducers of physical quantities made by an electrostatic anodic bonding of semi-conductor and dielectric elements

# 12, December 2012
DOI: 10.7463/0113.0517471
Article file: Цыганков_P.pdf (325.04Kb)
authors: A.B. Borzov, K.P. Likhoedenko, V. Yu. Cygankov, Yu.N. Tinyakov, K.A. Andreev, T.A. Civinskaya

References

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2. Kozlov A.G. Teplovye mikrosensory: konstruktivnye osobennosti [Thermal microsensors: design features]. Nano- i mikrosistemnaia tekhnika, 2008, no. 1, pp.16-28.

3. Kozlov A.G. Teplovye mikrosensory: klassifikatsiia, osnovnye tipy [Thermal microsensors: classification. basic types]. Nano- i mikrosistemnaia tekhnika, 2006, no. 4, pp. 2-13.

4. Barinov I.N. Konstruktsiia i nekotorye rezul'taty issledovanii magnitodiodov pri vozdeistvii temperatur shirokogo diapazona [The design and some results of researches of magnetic diodes under the influence of a wide range of temperatures]. Komponenty i tekhnologii [Components & Technologies], 2009, no. 1, pp. 18-21.

5. Telets V.A., Negina Iu.S., Orlov A.A. Izgotovlenie trekhmernykh MEMS metodami termokompressionnoi svarki [Manufacturing of 3D-MEMS by the thermocompression welding]. Nano- i mikrosistemnaia tekhnika, 2004, no. 3, pp. 2-6.

6. Barinov I.N. Poluprovodnikovye tenzorezistivnye datchiki davleniia na osnove KND-struktury [Semiconductor tensor resistive pressure sensors based on silicon-on-insulator structure]. Komponenty i tekhnologii [Components & Technologies], 2009, no. 5, pp. 12-15.

7. Evstratov A.A., Lukashenko T.A., Tupik A.N. Primenenie fotootverzhdaemykh opticheskikh kleev dlia germetizatsii analiticheskikh mikrochipov [The use of optical photocurable adhesives for sealing analytical microchips]. Nauchnoe priborostroenie [Scientific Instrument Engineering.], 2010, vol. 20, no. 1, pp. 29-38.

8. Kutchoukov V.G., Laugere F., van Der Vlist W., et al. Fabrication of Nanofluidic Devices Using Glass-to-Glass Anodic Bonding. Sensors and Actuators. A: Physical, 2004, vol. 114, no. 2-3, pp. 521-527. http://dx.doi.org/10.1016/j.sna.2003.12.027

9. Wei J, Nai S.M.L., Wong C.K., Lee L.C. Glass-to-Glass Anodic Bonding Process and Electrostatic Force. Thin Solid Films, 2004, vols. 462-463, pp. 487-491. DOI: 10.1016/j.tsf.2004.05.067 

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